IC design houses can no longer ship chips with only bare metal software. Driven by time-to-market constraints, OEMs are less inclined to invest in software development and demand that chip makers also supply fully developed and tested software stacks. For IC design houses, this introduces an additional challenge – they must now grapple not only with design challenges introduced by lower process nodes but also with the complexity of developing and testing a software stack sitting on top of their chips.
How can IC design houses overcome these two dynamically different challenges?
The T&VS Solution
T&VS provides end-to-end support for IC design houses, partnering with them at each stage of the chip design and software development process – from Architectural Modeling through RTL and Verification, all the way up to validation, test engineering and full stack development. IC design houses now have a reliable partner who can provide industry standard sign-off at each stage of the Silicon to Software lifecycle.
Solutions and Services